Cypress Semiconductor CY7C1514KV18-200BZC Mfr Package Description: 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Package Shape: RECTANGULAR Package Style: GRID ARRAY, LOW PROFILE Surface Mount: Yes Terminal Form: BALL Terminal Pitch: 1 mm Terminal Finish: TIN LEAD Terminal Position: BOTTOM Number of Functions: 1 Number of Terminals: 165 Package Body Material: PLASTIC/EPOXY Temperature Grade: COMMERCIAL Memory Width: 36 Organization: 2M X 36 Memory Density: 7.55E7 deg Operating Mode: SYNCHRONOUS Number of Words: 2.10E6 words Number of Words Code: 2M Operating Temperature-Max: 70 Cel Operating Temperature-Min: 0.0 Cel Supply Voltage-Max (Vsup): 1.9 V Supply Voltage-Min (Vsup): 1.7 V Supply Voltage-Nom (Vsup): 1.8 V Memory IC Type: QDR SRAM Parallel/Serial: PARALLEL Access Time-Max (tACC): 0.4500 ns